Polishing Machine Tender

444 674 Kč (CZK)/yr

213,79 Kč (CZK)/hr

5 870 Kč (CZK)/yr

The average polishing machine tender gross salary in Prague, Czech Republic is 444 674 Kč or an equivalent hourly rate of 214 Kč. This is 27% higher (+93 912 Kč) than the average polishing machine tender salary in Czech Republic. In addition, they earn an average bonus of 5 870 Kč. Salary estimates based on salary survey data collected directly from employers and anonymous employees in Prague, Czech Republic. An entry level polishing machine tender (1-3 years of experience) earns an average salary of 339 990 Kč. On the other end, a senior level polishing machine tender (8+ years of experience) earns an average salary of 530 331 Kč.

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608 671 Kč (CZK)

37 %

Based on our compensation data, the estimated salary potential for Polishing Machine Tender will increase 37 % over 5 years.

Education data not available for this job

Prague, Czech Republic

The cost of living in Prague, Czech Republic is 15% more than the average cost of living in Czech Republic. Cost of living is calculated based on accumulating the cost of food, transportation, health services, rent, utilities, taxes, and miscellaneous.

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Prague ( PRAHG; Czech: Praha [ˈpraɦa] ) is the capital and largest city of the Czech Republic and the historical capital of Bohemia. On the Vltava river, Prague is home to about 1.4 million people. The city has a temperate oceanic climate, with relatively warm summers and chilly winters. Prague is a political, cultural, and economic hub of central Europe, with a rich history and Romanesque, Gothic, Renaissance and Baroque architectures. It was the capital of the Kingdom of Bohemia and residence of...

Sourced from Wikipedia
Tends abrading machines that polish or lap surface of semiconductor wafers: reads work order to determine specifications. Loads wafers or carriers containing wafers onto polishing or lapping machine. Adjusts machine controls or loads programmed control media in machine to regulate pressure, time, and slurry flow. Starts lapping machine that removes saw marks and reduces wafer thickness or starts polishing machine... that polishes wafers. Observes machine operation and listens to sounds of belts, cams, and abrading wheel to detect machine malfunctions. Adjusts mechanisms or requests repairs as necessary. Stops machine at prescribed time, removes wafers from machine, and rinses wafers with water to cool wafers and remove slurry. Examines wafers for defects, and measures wafer thickness, using thickness gauge. May clean wafers, using chemical solutions, water, or gases, to remove contaminants from wafer surface. May mount wafers onto carriers. May mix slurry. May tend machine that rounds wafer edges and be designated edge-round tender. May be designated according to machine tended as lapping machine tender. Read More

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Disclaimer

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ERI’s compensation data are based on salary surveys conducted and researched by ERI. Cost of labor data in the Assessor Series are based on actual housing sales data from commercially available sources, plus rental rates, gasoline prices, consumables, medical care premium costs, property taxes, effective income tax rates, etc.

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