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Polishing Machine Tender
$40,305 (USD)/yr
$19.38 (USD)/hr
$532 (USD)/yr
The average polishing machine tender gross salary in Philadelphia, Pennsylvania is $40,305 or an equivalent hourly rate of $19. This is 6% higher (+$2,105) than the average polishing machine tender salary in the United States. In addition, they earn an average bonus of $532. Salary estimates based on salary survey data collected directly from employers and anonymous employees in Philadelphia, Pennsylvania. An entry level polishing machine tender (1-3 years of experience) earns an average salary of $30,834. On the other end, a senior level polishing machine tender (8+ years of experience) earns an average salary of $48,097.
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This page is a promotion for SalaryExpert’s Assessor Platform and is not intended for professional use.
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ERI’s compensation data are based on salary surveys conducted and researched by ERI. Cost of labor data in the Assessor Series are based on actual housing sales data from commercially available sources, plus rental rates, gasoline prices, consumables, medical care premium costs, property taxes, effective income tax rates, etc.
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Salary Potential
$45,273 (USD)
12 %
Based on our compensation data, the estimated salary potential for Polishing Machine Tender will increase 12 % over 5 years.
Most Popular Skills for Polishing Machine Tender
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Education data not available for this job
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City Overview
The cost of living in Philadelphia, Pennsylvania is 25% more than the average cost of living in the United States. Cost of living is calculated based on accumulating the cost of food, transportation, health services, rent, utilities, taxes, and miscellaneous.
View Cost of Living PagePhiladelphia, commonly referred to as Philly, is the most populous city in the U.S. state of Pennsylvania and the second-most populous city in the Northeast megalopolis and Mid-Atlantic regions after New York City. Philadelphia is known for its extensive contributions to United States history, especially the American Revolution, and served as the nation's capital until 1800. It maintains contemporary influence in business and industry, culture, sports, and music. Philadelphia is the nation's sixth...
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Job Description
Tends abrading machines that polish or lap surface of semiconductor wafers: reads work order to determine specifications. Loads wafers or carriers containing wafers onto polishing or lapping machine. Adjusts machine controls or loads programmed control media in machine to regulate pressure, time, and slurry flow. Starts lapping machine that removes saw marks and reduces wafer thickness or starts polishing machine... that polishes wafers. Observes machine operation and listens to sounds of belts, cams, and abrading wheel to detect machine malfunctions. Adjusts mechanisms or requests repairs as necessary. Stops machine at prescribed time, removes wafers from machine, and rinses wafers with water to cool wafers and remove slurry. Examines wafers for defects, and measures wafer thickness, using thickness gauge. May clean wafers, using chemical solutions, water, or gases, to remove contaminants from wafer surface. May mount wafers onto carriers. May mix slurry. May tend machine that rounds wafer edges and be designated edge-round tender. May be designated according to machine tended as lapping machine tender.
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Disclaimer
This page is a promotion for SalaryExpert’s Assessor Platform and is not intended for professional use.
Professionals should subscribe to SalaryExpert’s Assessor Platform.
ERI’s compensation data are based on salary surveys conducted and researched by ERI. Cost of labor data in the Assessor Series are based on actual housing sales data from commercially available sources, plus rental rates, gasoline prices, consumables, medical care premium costs, property taxes, effective income tax rates, etc.
Most Popular Skills for Polishing Machine Tender
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