Wafer Polisher Salary in United States

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Average Salary for Wafer Polisher in United States

The average salary of a(n) Wafer Polisher in United States is $32,315.

The average hourly rate of a(n) Wafer Polisher in United States is $15.54.

The average bonus of a(n) Wafer Polisher in United States is $427.00.

Job Description:

Tends abrading machines that polish or lap surface of semiconductor wafers: reads work order to determine specifications. Loads wafers or carriers containing wafers onto polishing or lapping machine. Adjusts machine controls or loads programmed control media in machine to regulate pressure, time, and slurry flow. Starts lapping machine that removes saw marks and reduces wafer thickness or starts polishing machine that polishes wafers. Observes machine operation and listens to sounds of belts, cams, and abrading wheel to detect machine malfunctions. Adjusts mechanisms or requests repairs as necessary. Stops machine at prescribed time, removes wafers from machine, and rinses wafers with water to cool wafers and remove slurry. Examines wafers for defects, and measures wafer thickness, using thickness gauge. May clean wafers, using chemical solutions, water, or gases, to remove contaminants from wafer surface. May mount wafers onto carriers. May mix slurry. May tend machine that rounds wafer edges and be designated edge-round tender. May be designated according to machine tended as lapping machine tender. Less

Tends abrading machines that polish or lap surface of semiconductor wafers: reads work order to determine specifications. Loads wafers or carriers containing wafers onto polishing or lapping machine. Adjusts machine controls or loads programmed control media in machine to regulate... More

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EES Technician - CMP - Colorado Springs, CO

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CMP – Ebara EPO 222 Polishers, Nova systems, On-Trak Scrubber, DNS Scrubber, Chemical distribution systems. Provide technical support in the Wafer Fab area by...

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